BS EN 62047-8-2011 PDF

Full title and description

STB BS EN 62047-8:2011 — Semiconductor devices — Micro-electromechanical devices — Part 8: Strip bending test method for tensile property measurement of thin films. This document is the British/European adoption of IEC 62047-8:2011 and specifies a strip‑bending test suitable for measuring tensile properties of thin films used in MEMS and related microfabricated devices.

Abstract

This standard defines a strip bending test method to obtain tensile properties of thin films with high accuracy and repeatability while requiring moderate alignment and handling effort compared with conventional tensile tests. It is intended for test pieces with thicknesses from about 50 nm up to several micrometres and for specimens having an aspect ratio (length to thickness) greater than about 300; the method is widely applicable to MEMS and micro‑machine structures and can be used for production quality control.

General information

• Status: Published / Definitive (BS EN adoption of IEC 62047-8:2011).
• Publication date: IEC publication date: 14 March 2011; EN/BS adoption/publication in 2011 (BS EN listing: 30 June 2011).
• Publisher: International Electrotechnical Commission (IEC) — base publication; adopted/published as EN by CENELEC and as BS by BSI (national sales/distribution via national bodies).
• ICS / categories: 31.080.99 — Other semiconductor devices / MEMS testing.
• Edition / version: Edition 1.0 (2011), identical adoption as EN/BS EN 62047-8:2011.
• Number of pages: Typically published as 22 pages in national EN/BS editions (national catalogs) while the IEC webstore lists 36 pages for the IEC base publication (format/packaging differences possible).

Scope

Specifies the strip bending test method for measuring tensile properties (such as tensile strength, elastic modulus and related parameters) of thin films used in micro‑electromechanical systems (MEMS). The method applies to hanging strip (bridge) test pieces that are easier to fabricate in MEMS processes than conventional tensile specimens; it covers test apparatus, specimen geometry and preparation, test procedure, data analysis and reporting, and provides informative annexes on data analysis using nanoindentation, test‑piece fabrication and the effects of misalignment and geometry on measurements. Applicable specimen thickness range is roughly 50 nm to several micrometres with aspect ratios >300.

Key topics and requirements

• Definition of test apparatus and calibrated bending fixtures suitable for strip bending tests.
• Dimensional and geometric requirements for strip (bridge) test pieces and recommended fabrication practices for MEMS test specimens.
• Step‑by‑step test procedure: mounting, alignment tolerances, bending protocol, and controlled loading/unloading sequences.
• Data analysis methods to extract tensile properties from bending data, including methods adapted for nanoindentation-based measurement systems (informative annex).
• Reporting requirements: specimen identification, test conditions, measured values, uncertainties and notes on possible artefacts (misalignment, geometry effects).
• Informative annexes covering test‑piece fabrication (MEMS processes) and the influence of misalignment and geometry on property measurement.

Typical use and users

Used by MEMS designers and manufacturers, materials and microfabrication research laboratories, semiconductor device test laboratories, quality‑assurance teams performing incoming/outgoing inspection, and standards bodies developing related test methods. The method is particularly useful where conventional macroscale tensile specimens cannot be produced and where high throughput or production‑level quality control is required.

Related standards

Part of the IEC/EN 62047 series addressing tensile testing of thin films and MEMS materials. Closely related documents include IEC 62047-2 (tensile testing method of thin film materials) and IEC 62047-3 (thin film standard test piece for tensile testing); consult the IEC/EN 62047 series for complementary methods and reference pieces.

Keywords

strip bending test; tensile property measurement; thin films; MEMS; micro‑electromechanical systems; test piece; nanoindentation data analysis; specimen geometry; material modulus; fracture strength.

FAQ

Q: What is this standard?

A: This is the British/European adoption (BS EN) of IEC 62047-8:2011, specifying a strip bending test method to measure tensile properties of thin films used in MEMS and similar microfabricated devices.

Q: What does it cover?

A: It covers the test apparatus, specimen geometry and preparation, the strip bending test procedure, data analysis to extract tensile properties, reporting requirements, and informative annexes on nanoindentation data analysis, MEMS fabrication of test pieces, and effects of misalignment and geometry.

Q: Who typically uses it?

A: MEMS manufacturers, semiconductor materials labs, university and industrial research groups working on thin‑film mechanics, and QA/test laboratories that need reliable tensile property measurements on microfabricated films.

Q: Is it current or superseded?

A: IEC 62047-8:2011 and its EN/BS EN adoption date from 2011. The IEC entry lists the 2011 edition as the published (edition 1.0) document and indicates stability information for the IEC publication; users should check with their national standards body for any corrigenda, amendments or later revisions before applying the standard.

Q: Is it part of a series?

A: Yes — it is one part of the IEC/EN 62047 series on tensile testing of thin films and MEMS (see related parts such as IEC 62047-2 and IEC 62047-3 for complementary methods and reference test pieces).

Q: What are the key keywords?

A: Strip bending, tensile properties, thin films, MEMS, test piece, nanoindentation, specimen geometry, modulus, strength.