TDS PDF

Base materials for printed circuits—Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test) Original standard JIS C 6489-1999 in PDF full version. Additional info + preview on request

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Base materials for printed circuits—Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) Original standard JIS C 6490-1998 in PDF full version. Additional info + preview on request

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Base materials for printed circuits—Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) Original standard JIS C 6492-1998 in PDF full version. Additional info + preview on request

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Base materials for printed circuits—Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board Original standard JIS C 6493-1999 in PDF full version. Additional info + preview on request

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Base materials for printed circuits—Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards Original standard JIS C 6494-1999 in PDF full version. Additional info + preview on request

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Copper foil for printed wiring boards Original standard JIS C 6515-1998 in PDF full version. Additional info + preview on request

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