TDS PDF

Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled. Original standard SAE AMS3684C-2016 in PDF full version. Additional info + preview on request

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Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F). Original standard SAE AMS3686A-2022 in PDF full version. Additional info + preview on request

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Adhesive Film, Humidity-Resistant, Epoxy For Sandwich Panels, −55 to +95 °C (65 to +200 °F). Original standard SAE AMS3687C-2016 in PDF full version. Additional info + preview on request

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Adhesive, Foaming, Honeycomb Core Splice, Structural −55 to +82 °C (−65 to +180 °F). Original standard SAE AMS3688B-2022 in PDF full version. Additional info + preview on request

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Adhesive, Foaming, Honeycomb, Core Splice, Structural −54 to +177 °C (−65 to +350 °F). Original standard SAE AMS3689B-2022 in PDF full version. Additional info + preview on request

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Adhesive Compound, Epoxy Room Temperature Curing. Original standard SAE AMS3690D-2016 in PDF full version. Additional info + preview on request

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