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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - X/Y CTE test for thin base materials by TMA. Original standard BS EN IEC 61189-2-805-2024 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (T_d) using TGA. Original standard BS EN IEC 61189-2-807-2021 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method. Original standard BS EN IEC 61189-2-808-2024 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA. Original standard BS EN IEC 61189-2-809-2025 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste using fine solder particles. Original standard BS EN IEC 61189-5-301-2021 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes. Original standard BS EN IEC 61189-5-501-2021 in PDF full version. Additional info + preview on request

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