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Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies. Original standard BS EN IEC 61189-5-502-2021 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards. Original standard BS EN IEC 61189-5-503-2017 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test methods for materials and assemblies. Process ionic contamination testing (PICT). Original standard BS EN IEC 61189-5-504-2020 in PDF full version. Additional info + preview on request
Document status: Active
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint and reflow heat. Original standard BS EN IEC 61189-5-601-2021 in PDF full version. Additional info + preview on request
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Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications. Original standard BS EN IEC 61190-1-3-2018 in PDF full version. Additional info + preview on request
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Printed board assemblies - Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies. Original standard BS EN IEC 61191-1-2018 in PDF full version. Additional info + preview on request
Document status: Active